It is anticipated that TSMC, a significant chip manufacturer, will start producing 2nm devices in the latter part of 2025. More transistors can be crammed onto a single processor thanks to this technology’s reduced transistor size, which could result in faster performance and lower power consumption.
Apple has a track record of embracing TSMC’s cutting-edge semiconductor technologies first. For instance, this year, TSMC’s 3-nanometer technology is used in both the M3 series CPUs found in Macs and the A17 Pro chip found in the iPhone 15 Pro.Once more, Apple is anticipated to be the first to test TSMC’s latest 2nm technology. The new node will also use a novel manufacturing technique called nanosheet-based gate-all-around field-effect transistors (GAAFET). Click Here for more information.
Comparing the technology to the FinFET transistors found in contemporary processors, greater speeds and lower power consumption might be possible.
But switching to GAAFET has its own set of difficulties. More specifically, TSMC will have to invest considerably in modifying its production process and construct additional fabs. It’s also likely that Apple, a significant TSMC customer, will have to modify its chip designs to take advantage of the new technology.
In addition to improving its existing 3nm process, TSMC is also enhancing its next 2nm node. The company is currently working on other chips including N3X and N3AE for high-performance computing and automotive applications, respectively, and has already improved its fabrication method in the new N3E and N3P semiconductors.
Rumour has it that TSMC is already investigating even more sophisticated 1.4-nanometer devices. As early as 2027, their arrival is anticipated. It should come as no surprise that Apple is allegedly hoping to have early access to this innovative technology as well.